Co-sputtered MoRe thin films for carbon nanotube growth-compatible
superconducting coplanar resonators
K. J. G. otz,
S. Blien, P. L. Stiller, O. Vavra, T. Mayer, T. Huber,
T. N. G. Meier, M. Kronseder, Ch. Strunk, and A. K. H¨uttel
Institute for Experimental and Applied Physics, University of Regensburg,
Universit¨atsstr. 31, D-93053 Regensburg, Germany
Molybdenum rhenium alloy thin films can exhibit superconductivity up to critical temperatures of
T
c
= 15 K. At the same time, the films are highly stable in the high-temperature methane / hydrogen
atmosphere typically required to grow single wall carbon nanotubes. We characterize molybdenum
rhenium alloy films deposited via simultaneous sputtering from two sources, with respect to their
composition as function of sputter parameters and their electronic dc as well as GHz properties at
low temperature. Specific emphasis is placed on the effect of the carbon nanotube growth condi-
tions on the film. Superconducting coplanar waveguide resonators are defined lithographically; we
demonstrate that the resonators remain functional when undergoing nanotube growth conditions,
and characterize their properties as function of temperature. This paves the way for ultra-clean
nanotube devices grown in situ onto superconducting coplanar waveguide circuit elements.
PACS numbers: 85.25.Am, 74.25.N-, 74.70.Ad
I. INTRODUCTION
The discovery of single-walled carbon nanotubes [1, 2]
opened the door for a wide range of both fundamental re-
search and technical applications in such electronic and
nano-electromechanical systems. These macromolecules
exhibit particular properties as, e.g., high mechanical,
chemical and thermal stability as well as excellent elec-
tronic and thermal conductance. They can carry high
currents, display outstanding room temperature transis-
tor characteristics, and may compete in the future with or
even replace conventional silicon-based logic devices [3–
5]. From a fundamental point of view carbon nanotubes
provide a highly promising material for quantum infor-
mation and computation. The macromolecules act as
quasi one-dimensional conductors because of their large
aspect ratio; the electrostatic definition of localized po-
tential wells can trap electrons in a nuclear spin free en-
vironment with well-defined quantum levels [6–10].
One way to ensure that the carbon nanotubes re-
main clean and defect-free is to grow them directly on
pre-fabricated contact electrodes, such that subsequently
no further lithography and / or wet chemistry takes
place. This technique has led to a multitude of strik-
ing measurement results, from single quantum dot spec-
troscopy [9, 11] to the characterization of high-Q vibra-
tional modes [12, 13]. Performing high-frequency mea-
surements on single wall carbon nanotube structures is
a logical extension. Many techniques applied for such
measurements on mesoscopic structures require the use
of on-chip radiofrequency electronics, in particular su-
perconducting coplanar waveguides and microwave res-
onators formed by these [15, 16]. An example for such
karl.goetz@ur.de
andreas.huettel@ur.de
a)
b)
RF-generator
DC source
ReMo
sample
29° 29°
Ar
gate
prospective device
sc coplanar waveguide
source
drain
sc ground
plane
CNT
FIG. 1. (Color online) (a) Schematic sketch of a carbon nan-
otube quantum dot device capacitively coupled to a coplanar
λ/2 resonator. For similar devices using different material
systems, see Refs. 14 and 15. (b) Sketch of the Orion dual-
source sputtering setup used during fabrication of our metal
thin films. The molybdenum target is driven by a radiofre-
quency source with impedance matching, the rhenium target
using a dc source. A mass flow controller sets the argon flow
into chamber.
a possible combined device structure is sketched in Fig.
1(a) a carbon nanotube is capacitively coupled to the
coplanar λ/2 resonator. In combination with the over-
growth process, this poses extensive difficulties, since the
carbon nanotube growth process typically 10-15 min in
a methane–hydrogen athmosphere [17] — is highly detri-
mental to superconducting thin films.
Several solutions for this problem have been proposed,
including transfer of the nanotube from a growth chip
to a second structure [8, 15, 16, 18, 19] or capping the
superconductor with a protection layer [14]. If the metal
film is to survive the CVD conditions, a high melting
point, as provided by e.g. rhenium and molybdenum,
becomes an important requirement.
Alloys of rhenium and molybdenum have been shown
to exhibit superconducting transition temperatures up
to 15 K [20–22]. Rhenium and molybdenum rhenium
alloy thin films remain stable under carbon nanotube
2
CVD growth conditions and subsequently still exhibit
superconducting behavior [23]. In addition, after in-situ
growth they provide transparent electronic contacts to
carbon nanotubes [9, 23, 24].
In the following, we characterize molybdenum rhenium
alloy films deposited via simultaneous sputtering from
two sources, i.e., cosputtering, with respect to their com-
position as function of sputter parameters and their dc
as well as GHz properties at low temperature. Specific
emphasis is placed on the effect of the carbon nanotube
growth conditions on the film. Coplanar waveguide λ/4
resonators are defined lithographically and characterized
at dilution refrigerator temperatures; even after undergo-
ing the growth conditions internal quality factors of up to
Q
i
5000 can be found. The temperature dependence of
the resonance frequency and the internal quality factor is
evaluated and found consistent with theoretical models.
II. THIN FILM DEPOSITION
Figure 1(b) sketches the setup used for the film fabri-
cation. The UHV-chamber with typical pressures in the
range of 10
8
to 10
7
mbar contains two sputter targets.
The sample holder is placed approximately 13.5 cm above
and in the middle of both targets which are mounted at
a distance of circa 15 cm to each other. Argon gas is in-
jected via a mass flow controller close to the molybdenum
target, and a plasma is ignited using a radiofrequency
drive at a chamber pressure of 10
1
mbar.
Subsequently the chamber pressure is reduced to 7
10
3
mbar and the argon plasma at the rhenium elec-
trode is ignited using a dc power supply; at the same
time the rf-output is adjusted such that the plasma close
to the molybdenum electrode and target remains stable.
As soon as both targets are sputtered, the shutters are
opened and the deposition of the MoRe alloy starts. By
keeping the chamber pressure constant over the whole
process time, the deposition rate of both materials is kept
approximately constant. In the following the alloy com-
position of the films is varied only by tuning one param-
eter, namely the output power P
Mo
of the rf-generator at
the molybdenum target.
III. RESULTING ALLOY
In order to obtain the alloy composition, X-ray photo-
electron spectroscopy (XPS) is performed on the cosput-
tered films [25, 26]. Within a predefined area of four to
ten square millimeters the samples are irradiated by a
monochromatic X-ray source, and the resulting emitted
photoelectrons are collected and spectroscopically ana-
lyzed with respect to energy and intensity. The chemical
sensitivity is given by the element-specific distribution of
binding energies E
B
of the electronic core levels.
Characteristic XPS data of a cosputtered film are plot-
ted in Fig. 2(a). The signal peaks corresponding to
O 1s
Re 4p Mo 3p
C 1s
Re 4d
Mo 3d
Re 4f
E
B
(eV)
100200300400 0
intensity (·10
3
a.u.)
5
10
15
surface spectrum
bulk spectrum
0.5
1.0
225230235240
E
B
(eV)
normalized intensity (1)
3
rd
etch
surface
bulk
0.5
1.0
normalized intensity (1)
35404550
E
B
(eV)
3
rd
etch
surface
bulk
a)
b)
c)
d)
e)
Re
Mo
C
O
Re
Mo
C
O
Re
Mo
C
O
Re
Mo
C
O
Re
Mo
O
Re
Mo
C
O
C
atomic percent
bulk
surface
etching steps
Re
Mo
69
31
70
30
74
26
70
30
74
26
80
20
20
40
60
80
RF-power at Mo-target (W)
at. perc. Mo in the alloy (%)
50 100 150 200
Mo proportion
Mo(P) = -28 + 77·10
-2
P - 17·10
-3
P
2
20
40
60
FIG. 2. (Color online) (a) Example X-ray photoelectron spec-
troscopy (XPS) spectrum of a deposited, unstructured film
on a p
++
-Si/SiO
2
substrate. A power setting of P
Mo
= 75 W
at the molybdenum source was used. The black line repre-
sents the chemical composition of the as-grown sample sur-
face, the red line was recorded after removing approximately
5 nm of the film by in-situ argon-ion sputtering beam sputter-
ing within the XPS chamber. Normalized detail spectra close
to the Mo 3d-peaks (b) and the Re 4f-peaks (c) (see text).
The energetic step size is set to 0.2 eV. (d) Depth profile
of the atomic composition, calculated from XPS spectra as
in (a), from surface to 5 nm depth (subsequently named
bulk). The resulting MoRe-alloy composition after each step
is stated above. (e) Relative molybdenum atomic percent-
age in the bulk film for different power settings P
Mo
at the
molybdenum target (see text).
atomic and molecular core levels have been identified fol-
lowing Ref. 27. The black curve in Fig. 2(a) reveals the
chemical composition of the topmost surface layers. This
is due to the small mean free path of the photoexcited
electrons within the film material of few nanometers. In
addition to characteristic peaks originating from molyb-
denum and rhenium core levels, also significant oxygen
3
and carbon peaks are observed. This is likely due to the
fact that all samples have been exposed to air during
transfer from the sputtering device into the UHV cham-
ber of the XPS setup.
Adsorbates and the film itself can be etched by in situ
Ar-sputtering for obtaining spectra from lower layers. An
etching step lasts several minutes at a chamber pressure
of less than 3 10
8
mbar in which the base pressure is
of 5 10
10
mbar. Etching steps are repeated until the
oxygen 1s-peak only negligibly contributes to the whole
spectrum (at most about 10%). The red (gray) line in
Fig. 2(a) displays the corresponding spectrum. Note that
also the carbon peak is now strongly suppressed. Subse-
quent tests using a profilometer show that approximately
5 nm of the films were removed. All spectra obtained
after such a corresponding etching step are henceforth
denoted as “bulk” spectra.
Figure 2(b) and 2(c) display details of the spectrum
close to the Mo 3d- and Re 4f- peaks, referenced to the
C 1s-peak.[26] The additional structure in the Mo 3d sur-
face spectrum originates from MoO
3
and MoO
2
forming
at the alloy surface [25, 28]. It decreases subsequently un-
til disappearing in the bulk where only the two Mo 3d
5/2
-
and Mo 3d
3/2
-peaks are part of the spectrum. In con-
trast, at the Re 4f-peak neither changes in the line shape
nor peak shifts are observed in the surface compared to
the bulk spectrum, indicating the absence of rhenium
oxides at the surface and in the bulk layers. All films
examined in this work exhibit the same behavior for the
rhenium peaks [25, 26].
All rhenium peaks of the film are shifted by 1.3 eV
to higher E
B
-values, compared to the literature values
of pure rhenium. Similar values have been identified in
Ref. 26 as chemical shift due to the Mo-Re compound
formation.
Using the method of area sensitivity factors and eval-
uating the Mo 3d-, Re 4f-, C 1s-, and O 1s-peaks, the
atomic concentrations of the sample have been estimated
[27]. Fig. 2(d) displays the atomic concentrations as a
function of depth. While the exposure to air leads to sig-
nificant carbon and oxygen percentages at the surfaces,
these both decrease strongly; for the “bulk” spectrum
about 10% of carbon remains.
Subsequently the molybdenum-rhenium alloy ratio is
obtained by normalizing to the sum of both sputtered
metals. As can be clearly seen in Fig. 2(e), where the
resulting alloy ratio in the bulk film is plotted as a func-
tion of rf power P
Mo
applied to the molybdenum sputter
source, the resulting molybdenum contribution in the al-
loy can be controlled over a wide range. The solid line in
Fig. 2(e) is a quadratic fit to the data points.
IV. INFLUENCE OF THE NANOTUBE
GROWTH ENVIRONMENT
Simulating the carbon nanotube chemical vapor de-
position (CVD) growth process typically used to locally
a)
E
B
(eV)
100200300400 0
5
10
intensity (·10
3
a.u.)
O 1s
Re 4p
Mo 3p
Re 4d
Mo 3d
Re 4f
surface spectrum
bulk spectrum
C 1s
b)
0.5
1.0
surface
bulk
225230235240
E
B
(eV)
normalized intensity (1)
c)
atomic percent
bulk
surface
Re
C
O
Re
Mo
C
Mo
20
40
60
80
FIG. 3. (Color online) (a) XPS spectrum of a molybdenum
rhenium film sputtered at P
Mo
= 75 W, after subsequent
30 min in the carbon nanotube CVD growth environment.
The energy step size is set to 0.2 eV. (b) Detailed zoom of the
Mo 3d peak. (c) Composition of the film at the surface and
at 5 nm depth (atomic percentage); note the large carbon
contribution.
grow few clean single-wall carbon nanotubes [17], the chip
including the MoRe thin film is heated up in an argon and
hydrogen gas flow, then exposed to a methane-hydrogen
atmosphere at about 900
C for several minutes and sub-
sequently cooled down under argon and hydrogen flow.
The XPS of a molybdenum rhenium alloy sputtered
with P
Mo
= 75 W after exposure to the CVD environment
is shown in Fig. 3(a), and a normalized detail plot of the
Mo 3d peak in Fig. 3(b). A strong carbon peak is visible
even in the bulk. Furthermore in both surface and bulk
molybdenum spectra oxide peaks are not observed, as
visible in Fig. 2(b).
Having in mind that molybdenum oxides exhibit dras-
tically lower melting points of 795
C for MoO
3
, and
1100
C for MoO
2
[29] than pure molybdenum with
2610
C [30], the data indicates that reduction of the ox-
ide to atomic molybdenum takes place during CVD.
An additionally possible process is the formation of
molybdenum carbides. The expected XPS peak of Mo
2
C
(E
B
= 227.75 eV) is very close to that of Mo 3d
5/2
(E
B
= 228 eV), which makes detection challenging with
our experimental resolution. Interestingly, molybdenum
carbides display superconductivity with critical tempera-
tures 6 K T
c
9 K [31]. However, typically the growth
of molybdenum carbide out of pure molybdenum, for ex-
ample in a nitrogen-xylene atmosphere, takes place at
temperatures higher than 900
C, see [31].
4
T (K)
2 4
6 8
20
40
60
80
I
c
(mA)
Mo
20
Re
80
Hall bar type B
10 min CVD
a)
b)
c)
d)
A
100 μm
0 10 20 30
growth time (min)
5
6
7
8
9
10
T
c
(K)
Mo
58
Re
42
Mo
20
Re
80
8
B (T)
Mo
20
Re
80
B
c0
=7.29 T
T
c0
=8.30 K
Mo
20
Re
80
30 min CVD
B
c0
=3.60 T
T
c0
=3.92 K
T
c
(K)
8
6
4
2
0
0
2 4
6 8
FIG. 4. (Color online) (a) Exemplary SEM micrograph of
a test Hall bar structure, type A. Dimensions are for type A
width W
A
= 28 µm and film thickness d
A
150 nm, for type B
W
B
= 5 µm and d
B
60 nm. (b) Measured critical current I
c
through a Hall bar device (type B), Mo
20
Re
80
, as a function
of temperature. (c) Critical temperature T
c
of Mo
20
Re
80
films
as a function of applied magnetic field B, with and without
CVD growth exposure. (d) Measured critical temperature T
c
as a function of CH
4
/H
2
flow time during the CVD process.
Straight lines are guides to the eye.
The area sensitivity factor analyzing method results
in a bulk composition of 26% carbon, 22% molybdenum,
and 49% rhenium plus neglectable oxygen residues. Since
the etching time for the bulk spectra has been kept con-
stant, it is obvious that the high carbon contribution does
not have its origin in atmospheric adsorbates but in dif-
fusion of carbon into the alloy during CVD. The relative
atomic ratio of the sputtered metals is Mo
31
Re
69
, indi-
cating structural changes during CVD.
Spectroscopy on a second sample using twice the gas
flow of methane results in a composition of 12% molyb-
denum, 23% rhenium, and even 58% carbon in the bulk.
From this we conclude that the penetration of carbon into
the alloy also increases. However, the resulting sputtered
metal ratio of Mo
34
Re
66
still remains close to the previ-
ous sample.
V. DC CHARACTERIZATION
To characterize the electronic properties of the co-
sputtered films at room temperature as well as at cryo-
genic temperatures, the fabricated thin films on top of
SiO
2
or Al
2
O
3
substrates are patterned into Hall bars
by means of optical lithography and SF
6
/Ar reactive ion
etching (see Fig. 4(a)). Afterwards, selected structures
are placed into the CVD furnace and exposed to the
nanotube growth environment for several minutes. All
measurements have been performed on films either ex-
amined by XPS (see last two sections) or deposited si-
multaneously to these in the same deposition step. De-
vices using two different alloy compositions have been ex-
amined, namely Mo
20
Re
80
and Mo
58
Re
42
obtained with
P
Mo
= 75 W and P
Mo
= 200 W, respectively.
At room temperature, compared to Mo
58
Re
42
both
resistivity and sheet resistance of the Mo
20
Re
80
sam-
ples are higher by a factor 3–5: before CVD we obtain
ρ 3.0 10
7
Ωm for Mo
58
Re
42
and ρ 9.0 10
7
Ωm
for Mo
20
Re
80
. Resistances slightly increase during ex-
position to the CVD environment, to ρ 4.0 10
7
Ωm
for Mo
58
Re
42
and 13 10
7
Ωm ρ 15 10
7
Ωm for
Mo
20
Re
80
.
Results of low-temperature measurements performed
on Mo
20
Re
80
devices are plotted in Fig. 4(b) and
Fig. 4(c). Independent from CVD-exposure, the residual-
rest-resistance values RRR for all Mo
20
Re
80
devices are
in the range 0.8 RRR 1.0. Fig. 4(b) displays the
critical current of a Mo
20
Re
80
film (Hall bar geometry B,
with T
c
= 9.2 K) after 10 min CVD exposure. It carries a
supercurrent up to I
c
80 mA, corresponding to a crit-
ical current density of j
c
2.7 10
5
A/mm
2
over a wide
temperature range up to ca. 5 K before the transition
to a normal conductor takes place above 8 K. This very
high value for j
c
is well in accordance with the results of
[32], where after high-temperature annealing critical cur-
rent densities of up to 1.810
5
A/mm
2
through suspended
Mo
50
Re
50
-nanostructures were reported.
A second Mo
20
Re
80
Hall bar device (type A, T
c
=
8.3 K), not exposed to CVD, exhibits a critical current
I
c
114 mA at T = 4.2 K, corresponding to a lower cur-
rent density j
c
= 2.8 10
4
A/mm
2
. Also much longer ex-
posure to the CVD environment again lowers the reach-
able critical current density.
Figure 4(c) displays data on the magnetic field depen-
dence of the critical temperature. Fitting the empiri-
cal relation B
c
(T ) = B
c0
1 (T /T
c0
)
2
[33] results in
high characteristic values B
c0
= 7.3 T and T
c0
= 8.3 K
expected for molybdenum rhenium alloys, where T
c0
de-
notes the zero field critical temperature and B
c0
the ex-
trapolated critical field at zero temperature. Again, as
observed for critical currents, prolonged (30 min) CVD
exposure results in a strong decrease of both values to
here B
c0
= 3.6 T and T
c0
= 3.9 K [32, 34]. This effect
is also visible in Figure 4(d), displaying the critical tem-
perature for two different alloy compositions. Even for
only 10 minutes growth time, T
c
of the Mo
58
Re
42
film
decreases to the half, well in accordance with the results
of Ref. 34. Interestingly, in contrast the Mo
20
Re
80
alloy
keeps its critical temperature range of 8 K T
c
9 K for
growth times up to 20 minutes, only reaching < 4 K after
30 minutes of exposure to the CH
4
/H
2
flow.
5
a) b)
3.596 3.598 3.6
0
-
3
-
6
-
9
f (GHz)
|S
21
|
2
(dB)
Q
i
= 23589
Q
c
= 10761
Θ = -0.04
f
r
= 3.59759 GHz
c)
-27
-30
-33
3
.
5
4
.
0
f (GHz)
|S
21
|
2
(dB)
Q
i
= 4985 Q
i
= 2666
Q
i
= 4121
3.25
1mm
FIG. 5. (Color online) (a) SEM image of a test structure with
three MoRe coplanar λ/4 resonators coupled to a feed line.
(b) Detail of the transmission S
21
(f)
2
at T = 100 mK of a
device as depicted in (a); the background value of S
21
(f)
2
has been subtracted. 150 nm pristine Mo
20
Re
80
; see the text
for a description of the fit. (c) Uncalibrated transmission
spectrum S
21
(f)
2
at T = 15 mK (dilution refrigerator mix-
ing chamber temperature) of a second 150 nm Mo
20
Re
80
de-
vice over a wider frequency range, now after 30 min exposure
to the CVD CH
4
/H
2
flow. Resonances corresponding to the
three λ/4 structures coupled to the feedline can still be clearly
identified.
VI. COPLANAR RESONATOR DEVICES
Coplanar waveguide λ/4 resonators were fabricated to
investigate the high frequency behavior of the alloy ma-
terial and its suitability for cavity quantum electrody-
namics and optomechanics experiments. After sputter-
ing of 150 nm Mo
20
Re
80
on SiO
2
or Al
2
O
3
substrates, the
structures were patterned using optical lithography and
reactive ion etching with SF
6
/Ar. A micrograph of a de-
vice coupling three λ/4 resonators to a common feed line
is shown in Fig. 5(a). The devices are glued on a printed
circuit board, bonded with aluminum bond wires and
subsequently characterized in a dilution refrigerator. On
the signal input side the experimental wiring of super-
conducting UTF85 semirigid NbTi cables includes atten-
uators as thermal anchoring at every temperature stage.
The input signal is attenuated by approximately 53 dB,
transmitted through the device under test and then am-
plified by 29 dB by a low noise HEMT amplifier[35] at
the 1 K stage.
Near its fundamental resonance frequency, given by the
length of the resonator l and an effective permittivity ε
eff
f
r
=
1
ε
eff
c
4l
, (1)
each of the three resonators behaves like a parallel
lumped-element RLC circuit, coupling energy out of the
feed line and leading to a distinct resonant drop in feed-
line transmission S
21
. In the vicinity of the resonance,
the transmitted signal can be expressed by [36]
S
21
= 1
Q
l
Q
e
e
1 + 2iQ
l
ff
r
f
r
, (2)
where 1/Q
l
= 1/Q
i
+ 1/Q
c
. Here, Q
i
is the material
and temperature dependent internal quality factor of the
λ/4 structure, and Q
c
the geometry dependent coupling
quality factor. Q
e
is a complex-valued parameter closely
related to the coupling quality factor Q
c
, whose finite
phase Θ can give rise to a line shape asymmetry due
to non-ideal circuit elements, e.g. a complex loading of
the resonator or impedance mismatches. Its real part
fulfils the condition Re[Q
1
e
] = Q
1
c
. Fig. 5(b) shows
the normalized data of the transmission S
21
2
for one
exemplary resonance of a pristine film at T = 100 mK. It
includes a fitted curve following Eq. 2; an intrinsic quality
factor of Q
i
23600 and a coupling quality factor of
Q
c
10800 are obtained. Fig. 5(c) displays an overview
plot of the uncalibrated transmission of a similar device,
this time after an exposure of 30 min to the hot CVD
gas mixture. Still, all three resonances can be clearly
recognized, with quality factors up to Q
i
5000.
VII. COPLANAR RESONATOR
TEMPERATURE DEPENDENCE
Fig. 6 shows the observed temperature dependence of
the resonance frequency f
r
(T ) (Figs. 6(a,c)) and the in-
ternal quality factor Q
i
(T )(Figs. 6(b,d)) for two devices.
The device of Figs. 6(a,b) (device 1) has been character-
ized after thin film deposition and patterning, the device
of Fig. 6(c,d) (device 2) has been additionally exposed to
the nanotube CVD growth environment.
As can be seen in the figure, the resonance frequency
f
r
clearly decreases at high temperatures (T 0.8 K for
device 1, T 0.4 K for device 2). This can be attributed
to a decrease in superfluid density of the superconducting
thin film. A related rise in the quasiparticle density leads
to a higher damping of the resonator and therefore to a
reduction of the internal quality factor. Following Mattis
and Bardeen [34, 37], the temperature dependence of f
r
can be expressed as
δf
r
f
0
=
α
0
2
δσ
2
σ
2
, (3)
with δf
r
(T )= f
r
(T ) f
0
the deviation of the resonance
frequency with finite temperature and f
0
= f
r
(T = 0)the
approximated resonance frequency at T = 0. In the limit
hf (T = 0) and k
B
T (T = 0) the imaginary
part σ
2
of the complex conductivity σ of the device can
be approximated using the temperature-dependent BCS
energy gap and the normal state conductivity σ
n
as
[38]
σ
2
σ
n
=
π
hf
1 2e
/k
B
T
e
hf/2k
B
T
I
0
hf
2k
B
T

, (4)
6
f
r
(GHz)
3.56
3.57
3.58
3.55
1 2 3 4
T (K)
δf
r
(kHz)
T (K)
0.2 1.0
0
20
40
60
a)
f
r
(GHz)
T (K)
4.20
4.24
1 3 5
c)
b)
T (K)
Q
i
(·10
3
)
Q
i
(·10
3
)
1 2 3 4
5
10
15
20
T
0.2
(K)
0.4
23.6
23.7
5
T (K)
Q
i
(·10
3
)
1
2
3
1 2 3
4 5
5
2 4
4.18
4.22
4.26
δf
r
(kHz)
T (K)
0.2 0.8
0
20
40
-20
-40
d)
Q
i
(·10
3
)
0.1
T (K)
4.25
4.35
0.2 0.3
FIG. 6. (Color online) Temperature dependence of reso-
nance frequency f
r
and internal quality factor Q
i
for two
λ/4 resonator devices. (a), (b) Resonance frequency f
r
(a)
and internal quality factor Q
i
(b) for device 1 (no CVD
treatment); compensation-doped silicon substrate covered by
500 nm thermal SiO
2
, 10 nm ALD-deposited Al
2
O
3
and a
150 nm thick Mo
20
Re
80
film. The insets display detail zooms
for low temperatures. (c), (d) Corresponding plots for de-
vice 2, after undergoing 10 min CH
4
/H
2
flow in the CVD
growth oven. Compensation-doped silicon substrate covered
by 500 nm thermal SiO
2
and 150 nm Mo
20
Re
80
. For a de-
scription of the fit models (solid and dashed lines) see the
text.
where I
0
(x)is a modified Bessel function of the first kind.
The parameter α
0
in Eq. 3 is the kinetic inductance frac-
tion in zero-temperature limit of the coplanar waveguide.
The solid red lines in Figs. 6(a,c) are fit curves corre-
sponding to this model, using in each case α
0
as a free pa-
rameter. The result agrees very well with the experimen-
tal data. For device 1 (no CVD) we obtain α
0
= 0.199,
for device 2 (after 10 min CVD) α
0
= 0.249. The value of
α
0
can be calculated from the normal-state conductance
σ
n
and the critical temperature T
c
following [39]. Us-
ing the parameters of our devices, we obtain α
th
= 0.243
and α
th
= 0.284, in reasonable agreement with the fit re-
sults. The corresponding functional dependence of f
r
(T )
is plotted in Figs. 6(a,c) each as a green dashed line.
In Figs. 6(b,d), clearly also the internal quality factor
Q
i
of the devices decreases at high temperature. Follow-
ing Mattis and Bardeen, the corresponding change of the
quality factor is
δ
1
Q
i
= α
0
δσ
1
σ
2
(5)
with the real part of the complex conductivity [38]
σ
1
σ
n
=
4∆
hf
e
/k
B
T
sinh
hf
2k
B
T
K
0
hf
2k
B
T
. (6)
Here K
0
(x) is a modified Bessel function of the second
kind. Using the parameters extracted in Figs. 6(a,c) we
can plot the corresponding expected temperature depen-
dence Q
i
(T ), again as solid red and dashed green lines;
while significant deviations exist, the overall tendency
agrees well with the data.
For T T
c
, the theory by Mattis and Bardeen pre-
dicts no change in the resonance frequency with tem-
perature. However, in our devices for T 0.5 K a slight
decrease in f
r
is observed, leading to an overall nonmono-
tonic behaviour of f
r
(T ), see the insets of Figs. 6(a,c).
This is consistent with the influence of two-level systems
(TLS) in the substrate contributing to both dissipation
and dispersion and can be described by [40–42]
δf
r
f
0
=
F
2
δε
ε
(7)
=
F ϑ
π
ReΨ
1
2
+
1
2π i
hf
r
(T )
k
B
T
ln
1
2π
hf
r
(T )
k
B
T

.
(8)
Here, Ψ is the digamma function, 0 < F < 1 the filling
factor, giving the ratio of the electric energy stored in the
TLS hosting material to the total electric energy stored
in the resonator, and ϑ the loss tangent of the substrate.
The insets of Figs. 6(a,c) show the measured data along
with a low-temperature fit, using the product F ϑ and f
0
as fit parameters.
In the case of device 1, Fig. 6(a), this results in
F ϑ = 3.968 10
5
. This value of F ϑ is comparable to
literature values for niobium resonators on sapphire, see
e.g. [43]. The fit value for F ϑ provides an approximation
for the TLS-related low-power, low-temperature internal
Q-factor Q
i,TLS
1/(F ϑ) 25000. As expected this
slightly exceeds our measured value of Q
i
(T = 20 mK)
23500. The fit for device 2 provides F ϑ = 4.087 10
5
.
This results in a quality factor Q
i,TLS
24500, compa-
rable to the value for device 1 and apparently insensitive
to the degradation of the device due to the CVD process.
Similar to f
0
, also the low-temperature behavior of the
quality factor Q
i
is governed by interactions with sub-
strate TLS. This can be modeled by [41, 42]
1
Q
i
= F ϑ
eff
tanh
hf
r
(T )
2k
B
T
+
1
Q
other
. (9)
Here, ϑ
eff
is an effective, reduced loss tangent which takes
into account that at strong driving the two-level sys-
tems are partially saturated and thereby unable to ab-
sorb energy. Q
other
describes dissipative processes unre-
lated to TLS. The fit for device 1 again agrees well with
7
the measured data (inset of Fig. 6(b)) and results in
F ϑ
eff
= 5.677 10
7
and Q
other
= 23800. For device 2
(inset of Fig. 6(d)) only few data points at low temper-
ature are available, and a saturation of the device tem-
perature cannot be excluded. Applying the fit, we obtain
F ϑ
eff
= 1.634 10
6
and Q
other
= 4370, dominating the
TLS contribution.
As can be seen in Fig. 6, the combined effect of two-
level systems and a temperature dependent superfluid
density provide a good description of our devices. Due
to the CVD process the kinetic inductance fraction in-
creases. The low temperature fits tentatively display sim-
ilar influence of two-level systems before and after CVD,
however a significant non-TLS induced dissipation term
results in the second, post-CVD device.
VIII. SUMMARY AND CONCLUSIONS
The x-ray photoelectron spectroscopy characterization
demonstrates that our co-sputtering process from two in-
dependent targets can generate MoRe thin films of con-
trolled alloy composition. We observe traces of molyb-
denum oxides at the film surface after ambient air ex-
posure. Exposing the thin films to the carbon nanotube
CVD growth environment, a significant amount of car-
bon is incorporated into the film. No clear indications
for the formation of molybdenum carbide can be found;
the surface oxide is absent after CVD, pointing towards
its reduction in the 850
C H
2
atmosphere.
In electrical characterization, we observe a higher re-
silience to the CVD process for Mo
20
Re
80
films; the crit-
ical temperature only drops below T
c
= 8 K for growth
times > 20 min. For shorter growth times, data indicates
that the CVD process may have effects similar to the
annealing discussed in [32], i.e., enhancing the critical
temperature and critical current density. We observe up
to j
c
2.7 10
5
A/mm
2
and T
c
9.2 K in a Hall bar
geometry.
λ/4 coplanar waveguide resonators were defined by
thin film deposition and subsequent reactive ion etching.
After structuring, we observe internal quality factors up
to Q
i
= 23700 in pristine devices and up to Q
i
= 5000 af-
ter undergoing the CVD process. The temperature evolu-
tion of the resonance frequency f
r
and the internal qual-
ity factor Q
i
of the devices can be understood for low
temperatures T 0.4 K via interaction with substrate
two-level systems, at higher temperatures T 0.8 K via
the decreasing superfluid density.
Mo
20
Re
80
clearly excels in terms of stability during
the CVD process, critical temperature and field as well
as critical current. However, the achieved quality fac-
tors are clearly lower than those reported in literature
for similar materials [34]. Our reference niobium devices
characterized for comparison have reached Q
i
4 10
5
,
excluding the detection setup as cause. The effect of the
CVD process in lowering Q
i
is similar to other published
observations [34]. Further improvements thus should be
targeted at the radiofrequency properties of the substrate
as well as the the pristine, as-deposited metal film and
coplanar waveguide resonators defined in it.
IX. ACKNOWLEDGMENTS
The authors gratefully acknowledge funding by the
Deutsche Forschungsgemeinschaft via SFB 631, GRK
1570, and Emmy Noether project Hu 1808/1.
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